Advanced logic scaling has created some difficult technical challenges, including a requirement for highly dense patterning. Imec recently confronted this challenge, by working toward the use of Metal ...
This paper uses Virtual Fabrication to assess the Imec 7nm node (iN7) Self-Aligned Quadruple Patterning (SAQP) integration scheme for the 16nm half-pitch Metal 2 line formation. We first present the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results