Some fabs build consumer chips that sit inside phones and laptops. Others build chips that must survive in orbit, under the Arctic ice, or deep beneath the Earth’s surface. Fabs serving defense, ...
Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs.
Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
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