米Micronは1月9日(現地時間)、LPDDR5Xメモリをベースに、優れた電力効率と省スペース性を兼ね備えたメモリーモジュール、LPCAMM2(low-power compression attached memory module)の提供を開始した。ノートPCや小型フォームファクタのデスクトップPCに、優れた転送速度と ...
アメリカの半導体素子標準規格を策定する団体・JEDECが、ノートパソコン用メモリモジュールの新しい規格となるCompression ...
ARLINGTON, Va., October 20, 2025--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is ...
After NVIDIA unveiled its personal supercomputer "Digits," major PC manufacturers such as Lenovo and HP have reportedly requested technical collaboration with Samsung Electronics and SK hynix to ...
Team Group, headquartered in Taiwan, announced on November 1, 2024, the introduction of their DDR5 memory modules compatible with the CAMM2 (Compression Attached Memory Module 2) standard. These ...
BOISE, Idaho, Jan. 09, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (MU), today unveiled the industry’s first standard low-power compression attached memory module (LPCAMM2) available in ...
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory maker ahead of ...
DRAMのメモリモジュール規格「DIMM」に代わる「CAMM」が採用され始めている。CAMMはDIMMとは何が違うのか。メモリモジュール進化の変遷を踏まえて解説する。 DIMMがまだ新しい技術に取って代わられていないのは、少々驚きだ。DIMMは、コンピュータ会社Wang ...
Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...
JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline ...
JEDEC, an organization that formulates semiconductor device standards in the United States, has announced that it will standardize Compression Attached Memory Module (CAMM2), a new standard for memory ...
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