アメリカの半導体素子標準規格を策定する団体・JEDECが、ノートパソコン用メモリモジュールの新しい規格となるCompression ...

米Micronは1月9日（現地時間）、LPDDR5Xメモリをベースに、優れた電力効率と省スペース性を兼ね備えたメモリーモジュール、LPCAMM2(low-power compression attached memory module）の提供を開始した。ノートPCや小型フォームファクタのデスクトップPCに、優れた転送速度と ...

AI infrastructure can't evolve as fast as model innovation. Memory architecture is one of the few levers capable of accelerating deployment cycles. Enter SOCAMM2 ...

Team Group, headquartered in Taiwan, announced on November 1, 2024, the introduction of their DDR5 memory modules compatible with the CAMM2 (Compression Attached Memory Module 2) standard. These ...

After NVIDIA unveiled its personal supercomputer "Digits," major PC manufacturers such as Lenovo and HP have reportedly requested technical collaboration with Samsung Electronics and SK hynix to ...

BOISE, Idaho, Jan. 09, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (MU), today unveiled the industry’s first standard low-power compression attached memory module (LPCAMM2) available in ...

Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory maker ahead of ...

Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...

ARLINGTON, Va., October 14, 2025--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has published the annual ...

If there's one thing PC power users dislike, it's not being able to upgrade their systems. The recent trend towards soldered RAM and storage has been annoying and now Dell has a new (old) twist on the ...

JEDEC, an organization that formulates semiconductor device standards in the United States, has announced that it will standardize Compression Attached Memory Module (CAMM2), a new standard for memory ...