Micron Targets AI Memory Growth With New Module And India Facility

Micron Technology (NasdaqGS:MU) has begun shipping customer samples of its 256 GB SOCAMM2 LPDRAM module for AI data centers.
EDN

TI launches power management devices for AI computing

Texas Instruments Inc. (TI) announced several power management devices and a reference design to help companies meet AI computing demands and scale power management architectures from 12 V to 48 V to ...
Guru3D

Micron samples 256GB SOCAMM2 LPDDR5X modules for denser AI servers

Micron has announced it is shipping customer samples of a 256GB SOCAMM2 module built around low-power DRAM for data center platforms. The module targets a growing pain point in modern server design: ...
Digi Times

Micron begins sampling 192GB low-power DRAM module for AI servers

Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...
Excite エキサイト

【東芝】電力密度を大幅に向上可能な「樹脂絶縁型SiCパワー半導体 ...

電力密度を大幅に向上可能な「樹脂絶縁型SiCパワー半導体モジュール」を開発 ～「小面積チップの分散配置設計」と「AIを活用した設計最適化」で、 熱抵抗を21％低減。電力変換器の小型化によりカーボンニュートラルの実現に貢献～ 概要 当社は、絶縁 ...